The focus of this 2½ day conference is state-of-the-art of mask technology and lithography, such as mask manufacturing, mask business, lithography and mask applications, emerging mask & lithography technologies, and mask & lithography equipment.

17 April 2020    submission of abstracts
3 July 2020       submission of manuscripts to SPIE
31 July 2020     submission of presentation materials

It provides a place where specialists from industry and advanced research as well as equipment and software providers become acquainted with new developments and results.

Mask Manufacturing and Mask Business
- Mask Data Preparation
- Pattern Generation: Writing, Etch, etc.
- Photomask Processes & Materials
- Metrology Tools & Technologies
- Defect Inspection & Repair
- Cleaning & Haze
- Pellicles & Mask Boxes
- Mask Process Yield & Cycle Time
- Photomasks for RET (OPC, ILT) ; PSM
- Mask Business and Management
- Mask Cost and Mask Development Strategy
- Future Mask Demand
Lithographic Systems and Processes
- Optical Resolution Enhancements including OPC,
Freeform Illumination, Source-Mask-optimization (SMO)
and Inverse Lithography Technology (ILT)
- Material-and Process driven Resolution Enhancements
including Multiple Patterning and Chemical Shrinking
- Immersion Lithography including Defectivity
- Lithography Process Control
- Lithography and Etch Simulation including rigorous
physical/chemical Models and Compact Models
Emerging Mask and Lithography Technologies
- EUV-Lithography including Masks, Materials Processes
and Infrastructure.
- Direct Write / Maskless Technologies including Multi-
Beam Technologies
- Nano-Imprint Lithography (NIL), Soft Lithography, and
Microprinting
- Applicationof Artificial Intelligence including Deep
Learning in Lithography
Emerging Applications
- Non-IC Applications including Si-Photonics, flat Panel
Displays and MEMS/MEOMS
- Lithographic Systems for non-IC Applications, including
Laser Direct Write, Interference Lithography, and Mask
Aligners

The EMLC 2020 International Program Committee

Conference Chairs
Behringer, Uwe, UBC Microelectronics, Ammerbuch, Germany
Finders, Jo, ASML, Veldhoven, The Netherlands

Conference Co-Chairs
Connolly, Brid, Toppan Photomasks Inc., Dresden, Germany
Gale, Chris, Applied Materials, Dresden, Germany
Hayashi, Naoya, DNP, Saitama, Japan

Program Chairs
Stolberg, Ines, Vistec Electron Beam, Jena, Germany
Erdmann, Andreas, Fraunhofer IISB, Erlangen, Germany
Loeschner, Hans, IMS Nanofabrication, Vienna, Austria

Program Co-Chairs
Peters, Jan Hendrik, bmbg consult, Radebeul, Germany
Sarlette, Daniel, Infineon, Dresden, Germany

Other Program Committee Members
Ehrmann, Albrecht, Carl Zeiss SMT Oberkochen, Germany
Farrar, Dave, HOYA Corporation, London, UK
Galler, Reinhard, Equicon, Jena, Germany
Kapilevich, Izak, AMAT, USA
Le Gratiet, Bertrand, ST Microelectronics, Crolles, France
Levinson, Harry J., HJL Lithography, Saratoga, CA, USA
Muehlberger, Michael, Profactor GmbH, Steyr-Gleink, Austria
Pain, Laurent, CEA, Grenoble, France
Ronse, Kurt, IMEC, Leuven, Belgium
Savari, Serap, Texas A&M University College Station, USA
Scheruebl, Thomas, Carl Zeiss SMT GmbH, Jena, Germany
Schnabel, Ronald, VDE/VDI-GMM, Frankfurt, Germany
Schulze, Steffen, Mentor Graphics Corp. Wilsonville, OR, USA
Seltmann, Rolf, Dresden, Germany
Tschinkl, Martin, AMTC, Dresden, Germany
Waelpoel, Jacques, ASML, Veldhoven The Netherlands
Wiley, Jim, Santa Clara, CA, USA
Wolf, Hermann, Photronics MZD GmbH, Dresden, Germany
Wurm, Stefan, ATICE LLC, Albany, NY, USA
Yoshitake, Shushuke, NuFlare, Japan
Zurbrick, Larry, Keysight Technologies, Santa Clara, CA, USA

The exhibition is the communicative core of the conference. Manufacturers and service provides present future and praxis oriented applications and products.

Catholic University in Leuven,
Belgium

Please contact GMM-Office for questions concerning the conference.

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