It provides a place where specialists from industry and advanced research as well as equipment and software providers become acquainted with new developments and results.

Mask Manufacturing and Mask Business
- Mask Data Preparation
- Pattern Generation: Writing, Etch, etc.
- Photomask Processes & Materials
- Metrology Tools & Technologies
- Defect Inspection & Repair
- Cleaning & Haze
- Pellicles & Mask Boxes
- Mask Process Yield & Cycle Time
- Photomasks for RET (OPC, ILT) ; PSM
- Mask Business and Management
- Mask Cost and Mask Development Strategy
- Future Mask Demand
Lithographic Systems and Processes
- Optical Resolution Enhancements including OPC,
Freeform Illumination, Source-Mask-optimization (SMO)
and Inverse Lithography Technology (ILT)
- Material-and Process driven Resolution Enhancements
including Multiple Patterning and Chemical Shrinking
- Immersion Lithography including Defectivity
- Lithography Process Control
- Lithography and Etch Simulation including rigorous
physical/chemical Models and Compact Models
Emerging Mask and Lithography Technologies
- EUV-Lithography including Masks, Materials Processes
and Infrastructure.
- Direct Write / Maskless Technologies including Multi-
Beam Technologies
- Nano-Imprint Lithography (NIL), Soft Lithography, and
Microprinting
- Applicationof Artificial Intelligence including Deep
Learning in Lithography
Emerging Applications
- Non-IC Applications including Si-Photonics, flat Panel
Displays and MEMS/MEOMS
- Lithographic Systems for non-IC Applications, including
Laser Direct Write, Interference Lithography, and Mask
Aligners

The EMLC 2024 International Program Committee

Conference Chairs
Behringer, Uwe, UBC Microelectronics, Ammerbuch, Germany
Finders, Jo, ASML, Veldhoven, The Netherlands

Conference Co-Chairs
Connolly, Brid, Toppan Photomasks Inc., Dresden, Germany
Hayashi, Naoya, DNP, Saitama, Japan

Program Chairs
Stolberg, Ines, Vistec Electron Beam, Jena, Germany
Erdmann, Andreas, Fraunhofer IISB, Erlangen, Germany
Loeschner, Hans, IMS Nanofabrication, Brunn am Gebirge & Vienna, Austria

Program Co-Chairs
Peters, Jan Hendrik, BMBG Consult, Radebeul, Germany

Other Program Committee Members
Abboud, Frank, Intel Corporation, Santa Clara, CA, USA
Born, René, Photronics MZB, Dresden, Germany
Ehrmann, Albrecht, Carl Zeiss SMT Oberkochen, Germany
Jefferies, James, HOYA Europe, London, UK
Galler, Reinhard, EQUIcon, Dresden, Germany
Le Gratiet, Bertrand, ST Microelectronics, Crolles, France
Levinson, Harry J., HJL Lithography, Saratoga, CA, USA
Muehlberger, Michael, Profactor, Steyr-Gleink, Austria
Noack, Nico, AMTC Dresden, Germany
Pain, Laurent, CEA, Grenoble, France
Ronse, Kurt, IMEC, Leuven, Belgium
Savari, Serap, Texas A&M University College Station, USA
Scheruebl, Thomas, Carl Zeiss SMT, Jena, Germany
Schnabel, Ronald, VDE/VDI-GMM, Offenbach am Main, Germany
Schneider, Jens, Infineon Technologies, Dresden, Germany
Schuch, Nivea, Applied Materials, Grenoble, France
Schulze, Steffen, Siemens EDA, Wilsonville, OR, USA
Seltmann, Rolf, RS litho consult, Dresden, Germany
Sundermann, Frank, STMicroelectronics, Crolles, France
Tiron, Raluca, CEA-Leti, Grenoble, France
Tschinkl, Martin, Toppan Photomasks, Germany
Varga, Ksenija, EV Group, St. Florian am Inn, Austria
Waelpoel, Jacques, ASML, Veldhoven The Netherlands
Wurm, Stefan, ATICE LLC, Albany, NY, USA
Yoshitake, Shusuke, NuFlare Technology, Yokohama, Japan
Zurbrick, Larry, Keysight Technologies, Santa Clara, USA

ZEISS endows the "ZEISS Award for Talents in Photomask Industry" 

The award was established in 2016 to support students working in the fields of photomasks.

To be considered,

• The student must present a poster or presentation at European Mask and Lithography Conference
• The students must identify themselves as a student during abstract submission
• The student must be the lead manuscript author
• The student must attend the conference and present it during the session or be present during the poster session

The award will be assessed by an award committee consisting of members of the EMLC Program Committee. Contributions will be judged for technical merit, relevance of the topic to the industry and the author’s ability to explain the work.

Winners will be awarded a ZEISS certificate and a trophy. He or she receives a donation of 2,500 EUR to cover the travel expenses.

Parallel to the EMLC 2024 Conference, there will be a Technical Exhibition with booth space for about 20 exhibitors on Tuesday, June 18^th and Wednesday, June 19^th 2024. Presentation tables and pin boards will be available.

Please, register in time for the exhibition!

Please contact GMM-Office for questions concerning the conference.

You would like to be informed about the next steps concerning this conference? So please register as prospective customer.