EMLC
EMLC - Online Event 2021 | June 22, 2021

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About

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In 2021, the EMLC will have a new look - as a one-day online event!

However, the focus of this new event remains unchanged: the main topics are state-of-the-art of mask technology and lithography, such as mask manufacturing, mask business, lithography and mask applications, emerging mask & lithography technologies, and mask & lithography equipment.

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target audience

Target Audience

The EMLC Conference annually brings together scientists, researchers, engineers and developers from around the world to present innovations at the forefront of research, manufacturing and application.

target audience

The EMLC Conference annually brings together scientists, researchers, engineers and developers from around the world to present innovations at the forefront of research, manufacturing and application.

It provides a place where specialists from industry and advanced research as well as equipment and software providers become acquainted with new developments and results.

Topics

Conference topics

Topics

Mask Manufacturing and Mask Business
- Mask Data Preparation
- Pattern Generation: Writing, Etch, etc.
- Photomask Processes & Materials
- Metrology Tools & Technologies
- Defect Inspection & Repair
- Cleaning & Haze
- Pellicles & Mask Boxes
- Mask Process Yield & Cycle Time
- Photomasks for RET (OPC, ILT) ; PSM
- Mask Business and Management
- Mask Cost and Mask Development Strategy
- Future Mask Demand
Lithographic Systems and Processes
- Optical Resolution Enhancements including OPC,
Freeform Illumination, Source-Mask-optimization (SMO)
and Inverse Lithography Technology (ILT)
- Material-and Process driven Resolution Enhancements
including Multiple Patterning and Chemical Shrinking
- Immersion Lithography including Defectivity
- Lithography Process Control
- Lithography and Etch Simulation including rigorous
physical/chemical Models and Compact Models
Emerging Mask and Lithography Technologies
- EUV-Lithography including Masks, Materials Processes
and Infrastructure.
- Direct Write / Maskless Technologies including Multi-
Beam Technologies
- Nano-Imprint Lithography (NIL), Soft Lithography, and
Microprinting
- Applicationof Artificial Intelligence including Deep
Learning in Lithography
Emerging Applications
- Non-IC Applications including Si-Photonics, flat Panel
Displays and MEMS/MEOMS
- Lithographic Systems for non-IC Applications, including
Laser Direct Write, Interference Lithography, and Mask
Aligners

Committee

Committee Members

Committee

The EMLC 2021 International Program Committee

Conference Chairs
Behringer, Uwe, UBC Microelectronics, Ammerbuch, Germany
Finders, Jo, ASML, Veldhoven, The Netherlands

Conference Co-Chairs
Connolly, Brid, Toppan Photomasks Inc., Dresden, Germany
Gale, Chris, Applied Materials, Dresden, Germany
Hayashi, Naoya, DNP, Saitama, Japan

Program Chairs
Stolberg, Ines, Vistec Electron Beam, Jena, Germany
Erdmann, Andreas, Fraunhofer IISB, Erlangen, Germany
Loeschner, Hans, IMS Nanofabrication, Vienna, Austria

Program Co-Chairs
Peters, Jan Hendrik, bmbg consult, Radebeul, Germany
Sarlette, Daniel, Infineon, Dresden, Germany

Other Program Committee Members
Ehrmann, Albrecht, Carl Zeiss SMT Oberkochen, Germany
Farrar, Dave, HOYA Corporation, London, UK
Galler, Reinhard, Equicon, Jena, Germany
Kapilevich, Izak, AMAT, USA
Le Gratiet, Bertrand, ST Microelectronics, Crolles, France
Levinson, Harry J., HJL Lithography, Saratoga, CA, USA
Muehlberger, Michael, Profactor GmbH, Steyr-Gleink, Austria
Pain, Laurent, CEA, Grenoble, France
Ronse, Kurt, IMEC, Leuven, Belgium
Savari, Serap, Texas A&M University College Station, USA
Scheruebl, Thomas, Carl Zeiss SMT GmbH, Jena, Germany
Schnabel, Ronald, VDE/VDI-GMM, Frankfurt, Germany
Schulze, Steffen, Mentor Graphics Corp. Wilsonville, OR, USA
Seltmann, Rolf, Dresden, Germany
Tschinkl, Martin, Toppan Photomasks Germany GmbH, Dresden, Germany
Waelpoel, Jacques, ASML, Veldhoven The Netherlands
Wiley, Jim, Santa Clara, CA, USA
Wolf, Hermann, Photronics MZD GmbH, Dresden, Germany
Wurm, Stefan, ATICE LLC, Albany, NY, USA
Yoshitake, Shushuke, NuFlare, Japan
Zurbrick, Larry, Keysight Technologies, Santa Clara, CA, USA

Program Schedule

Tuesday, June 22nd 2021 -
EMLC 2021 Live Panel Sessions

 

CEST
(Central European Summer Time)

Four Live Panel Sessions on Tuesday, June 22, 2021

08:00

The meeting is opened by the VDE GMM Meeting Host
Hatice Altintas

08:00 - 11:15                                          

Part 1

08:05 - 08:15

Welcome by Uwe Behringer , UBC Microelectronics,
EMLC 2021 Conference Chair

08:15 - 09:30

1st Panel on EUV Lithography
Topic:

EUV Lithography towards 2030

Panel Chair
Jo Finders, ASML, The Netherlands

Panel Co-Chair
Albrecht Ehrmann, Carl Zeiss SMT, Germany

Panelists

Gijsbert Rispens, ASML, The Netherlands
EUV system engineering imaging and resist

Ardavan Niroomand, IMEC, Belgium
Program director for ASML/IMEC Advanced Patterning Center

Heiko Feldmann, Carl Zeiss SMT, Germany
Head of Roadmap, initiating technology and product developments for semiconductor manufacturing equipment

Hazem Mesilhy, Fraunhofer IISB, Germany
PhD student/ researcher, computational lithography, High-NA EUV, mask 3D, optical simulations, multi-objective optimization

Renzo Capelli, Carl Zeiss SMS, Germany
System Engineering, ZEISS Semiconductor Mask Solutions (SMS), EUV mask metrology

Jan van Schoot, ASML, The Netherlands
Director EUV System Engineering

09:30 - 09:45

Short Break

09:45 - 11:15

2nd Panel on EUV Mask Topics

Topic:
Readiness of the Mask and Lithography Infrastructure for current and future EUV (phase shift masks and anamorphic)
and suitable tools for mask making in EUV

Panel Chair:
Jan Hendrik Peters, BMBG Consult, Germany

Panel Co-Chair:
Martin Tschinkl, Toppan Europe, Germany

Panelists

Tilmann Heil, Carl Zeiss SMT, Germany
Mask Repair;  Mask Qualification;
EUV: scaling for advanced nodes, High NA, phase shifting masks

Eelco van Setten, ASML, The Netherlands
EUV imaging - specifically High-NA, mask contribution to imaging or EPE

Takahiro Onoue, HOYA, Japan
EUV materials, especially PSM, transparent backside

Kei Hattori, SHIBAURA, Japan
EUV clean and etch, material properties, layout requirements

Joost Bekaert, IMEC, Belgium
Stitching and Black Borders, CNT Pellicle, Contour Metrology, OPC

Dong Gun Lee, ESOL, South Korea
EUV phase shift measurements

11:15 - 14:30

Casual Meetings during the break

Between the morning and afternoon session you have the possibility to casually meet with your peers in the meeting space wonder.me provided by the conference committee.
Just join with audio and video connected, move around and gather in small discussion circles. Within these circles, you will be automatically placed in a zoom-like video chat with your colleagues.

14:30 - 17:45

Part 2

14:35 - 14:45

Welcome by Uwe Behringer , UBC Microelectronics,
EMLC 2021 Conference Chair

14:45 - 16:00

3rd Panel on Manufacturing Data Analytics
Topic:

Turning Data into Silicon: The Digital Transformation of the Wafer Fabrication Processes

Panel Chair
Bertrand Le-Gratiet, ST Microelectronics, France

Panel Co-Chair
Serap Savari, Texas A&M University, USA

Panelists

Philippe Leduc, STMicroelectronics, France

Benjamin Lenz, Infineon, Germany
Infineon Technologies AG Senior Manager Offline Analytics

Harry J. Levinson, HJL Lithography, USA
HJL Lithography, LLC provides consulting and training services in lithography and lithography process and control

Jelle Nije, ASML, The Netherlands
Senior product manager, Advanced Analytics portfolio enabling fast time to insight and optimize decision making

Clemens Utzny, KLA QONIAC, Germany
Qoniac provides revolutionary lithography & patterning optimization for the semiconductor industry

16:00 - 16:15

Short Break

16:15 - 17:30

4th Panel on Career opportunities for young scientists and engineers in semiconductor lithography and mask industry

Panel Chair
Andreas Erdmann, Fraunhofer IISB, Germany

Panel Co-Chair
Ines Stolberg, Vistec Electron Beam, Germany
Manager Sales & Marketing

Panelists

René Carpaij, ASML, The Netherlands
Group Leader EUV Imaging

Jan Hoentschel, Globalfoundries, Germany
Director Integration & Technology

Bertrand Le-Gratiet, ST Microelectronics, France
Fellow Lithography/ Metrology

Hans-Jürgen Stock, Synopsys Munich, Germany
Manager Research and Prototyping

Michael Woittennek, X-Fab, Germany
Manager Operations

Holger Jennewein, Carl Zeiss SMT, Germany
Director Optics Metrology

17:30 - 17:45

Final Remarks, Uwe Behringer, UBC Microelectronics and EMLC Conference Chair 2021
Announcement of EMLC 2022, in Leuven, Belgium, on June 20-23, 2022

 

Chairs and Panelists
Zuschauer spenden Beifall

Chairs and Panelists

May we present you the EMLC Panel Chairs and Panelists.

Zuschauer spenden Beifall

May we present you the EMLC Panel Chairs and Panelists.

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Contact

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Please contact GMM-Office for questions concerning the conference.

You would like to be informed about the next steps concerning this conference? So please register as prospective customer.

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previous events

Previous Events

Important Dates

Dates in 2021 and 2022
June 22, 2021EMLC Event 2021
June 20-23, 2022EMLC Conference 2022, Leuven, Belgium

 

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