Exciting and wide-ranging conference program
The EMLC 2025 featured 15 sessions with 30 presentations, 22 posters, 4 keynotes and 6 student presentations!
In the keynotes from ESMC, Globalfoundries, Infineon and Zeiss, the audience gained an insight into the ongoing construction projects at the Dresden site and current technological developments. The presentation by ESMC (a joint venture between TSMC, Bosch, Infineon and NXP) showed very clearly and practically the effort and meticulousness required to get a semiconductor factory up and running and, thanks to the European Chips Act, we can once again observe this in Central Europe.
The keynote from Zeiss presented an overview of the theoretical and technological challenges to be overcome in order to achieve the promised performance of the latest lithography technologies, including High-NA EUV (13.5 nm wavelength of the light used and 0.55 numerical aperture of the optical system). To quote an example from the presentation about the scale of the challenges: In the mid-1980s, when this conference first took place, the necessary optical bandwidth of the most powerful lithography devices was around 1 megapixel per mm2. Today, this value is around 10 gigapixels per mm2 – i.e. 10,000 (!) times more objects have to be reliably imaged on the same surface area than approximately 40 years ago. This describes the current requirements for the physics and chemistry of these technologies quite clearly, and the other presentations and posters were dedicated to this in detail.
For the detailed program description, please see the follow-up report by Reinhard Galler in the download-section.