It provides a place where specialists from industry and advanced research as well as equipment and software providers become acquainted with new developments and results.

1. Mask Technology, Manufacturing, and Business

• Photomasks, EUV masks and masks for emerging lithography techniques
• Mask materials, substrates, reflective multilayers, absorbers and coatings
• Mask data preparation, fracture, curvilinear data and data formats
• Laser, electron-beam and multi-beam mask writing
• Mask process technology, cleaning, contamination control, handling, pellicles and transport systems
• Defect inspection, review, repair, qualification and printability
• Registration, CD, phase, reflectivity and mask-topography metrology
• Curvilinear mask workflows from design and writing to inspection, metrology, repair and mask-to-wafer fidelity
• Yield, cycle time, productivity, cost, supply chain, business trends and future demand
• Large-area and non-semiconductor masks

2. Exposure Systems, Optics, and Imaging

• i-line, KrF, ArF dry and immersion, EUV, High-NA EUV, Hyper-NA EUV and future exposure systems
• Illumination, projection optics, stages, alignment, focus, leveling, overlay, stitching and scanner matching
• EUV sources, collectors, optics, contamination control, lifetime and availability
• Imaging physics, polarization, flare, aberrations, mask 3D effects, shadowing and anamorphic imaging
• System performance, qualification, productivity, reliability and cost of ownership
• Future light sources and wavelengths, including beyond-EUV concepts

3. Computational Lithography, Design Enablement, and Data

• Optical proximity correction, source-mask optimization, inverse lithography and curvilinear patterning
• Computational imaging, rigorous electromagnetic simulation, compact models and process modeling
• Computational etch and pattern-transfer simulation
• AI/ML-enabled modeling, optimization, metrology and process control
• Model calibration, validation, uncertainty quantification, benchmarks and digital twins
• GPU/HPC acceleration, data pipelines, interoperability and secure workflows
• Design-technology co-optimization and manufacturability

4. Patterning Materials, Processes, and Integration

• Photoresists and materials for optical, EUV, electron-beam and emerging lithography techniques
• Chemically amplified, metal-oxide, molecular and other novel resist platforms
• Underlayers, developers, dry development, surface treatments and ancillary materials
• Single and multiple patterning; tone inversion; shrink, trim, smoothing and pattern rectification
• Stochastics, roughness, resolution-sensitivity trade-offs, pattern collapse and defectivity
• Etch, deposition, selective processing, pattern transfer and process integration
• Directed self-assembly, including high-χ materials and defectivity control
• Sustainable materials and processes

5. Metrology, Inspection, and Process Control

• Mask and wafer CD, overlay, registration, focus, dose, edge-placement error and roughness metrology
• Actinic and non-actinic inspection, defect review and defect printability
• Optical, electron, X-ray, scanning-probe and hybrid metrology
• Computational metrology, reconstruction, AI/ML and sensor/data fusion
• Calibration, reference standards, traceability, measurement uncertainty and sampling
• In-line monitoring, advanced process control, yield learning and equipment diagnostics

6. Emerging Lithography and Nanofabrication

• Nanoimprint lithography, soft lithography and microprinting
• Maskless and direct-write technologies, including laser, electron, ion and multi-beam approaches
• Two-photon and multiphoton lithography
• Bottom-up and hybrid patterning
• Novel imaging, writing, replication and pattern-transfer concepts
• Research infrastructure, prototyping and transition to manufacturing

7. Applications, Advanced Integration, and Sustainability

• Advanced packaging, chiplets, heterogeneous integration and wafer-level integration
• 3D integration, backside processing and alignment and high-aspect-ratio patterning
• Photonics, metasurfaces, flat-panel / microdisplays and AR/VR devices
• MEMS, sensors, bio- and life-science devices and microfluidics
• Patterning for quantum technologies
• Patterning and integration for AI and high-performance-computing hardware
• Sustainability, resource efficiency, emissions, waste, circularity and life-cycle assessment

Cross-disciplinary contributions

Cross-disciplinary papers are strongly encouraged. Contributions should identify the technical challenge, describe the approach and evidence and explain the significance of the results for research or industrial application. A manuscript submission is required.

The EMLC 2027 International Program Committee

Honorary President
Behringer, Uwe, UBC Microelectronics, Ammerbuch, Germany

Conference Chairs
Stolberg, Ines, Vistec Electron Beam, Jena, Germany
Finders, Jo, ASML, Veldhoven, The Netherlands

Conference Co-Chairs
Connolly, Brid, Tekscend Photomask, Dresden, Germany
Hayashi, Naoya, DNP, Saitama, Japan

Program Chairs
Loeschner, Hans, IMS Nanofabrication, Brunn am Gebirge & Vienna, Austria
Bottiglieri, Gerardo, ASML, The Netherlands
Erdmann, Andreas, Fraunhofer IISB, Erlangen, Germany
Peters, Jan Hendrik, BMBG Consult, Radebeul, Germany

Other Program Committee Members
Abboud, Frank, Intel Corporation, Santa Clara, CA, USA
Ehrmann, Albrecht, Carl Zeiss SMT Oberkochen, Germany
Fay, Aurelien, CEA-Leti, Grenoble, France
Galler, Reinhard, EQUIcon, Dresden, Germany
Hai, Xueying, Mycronic AB, Täby, Sweden
Jefferies, James, HOYA Europe, London, UK
Le Gratiet, Bertrand, ST Microelectronics, Crolles, France
Levinson, Harry J., HJL Lithography, Saratoga, CA, USA
Maas, Raymond, ASML, Veldhoven, The Netherlands
Maly, Enrico, Photronics MZD GmbH, Dresden, Germany
Matsumoto, Hiroshi, NuFlareTechnology, Yokohama, Japan
Muehlberger, Michael, Profactor, Steyr-Gleink, Austria
Noack, Nico, AMTC Dresden, Germany
Pain, Laurent, CEA, Grenoble, France
Ronse, Kurt, IMEC, Leuven, Belgium
Scheruebl, Thomas, Carl Zeiss SMT, Jena, Germany
Schnabel, Ronald, VDE/VDI-GMM, Offenbach am Main, Germany
Schneider, Jens, Infineon Technologies, Dresden, Germany
Schuch, Nivea, Applied Materials, Grenoble, France
Sundermann, Frank, STMicroelectronics, Crolles, France
Tchikoulaeva, Anna, Lasertec, Dresden, Germany
Tschinkl, Martin, Tekscend Photomask, Dresden, Germany
Varga, Ksenija, EV Group, St. Florian am Inn, Austria
Wurm, Stefan, ATICE LLC, Albany, NY, USA
Zeggaoui, Nassima, Siemens Industry Software Inc., Meylan, France
Zurbrick, Larry, Keysight, Santa Rosa, CA, USA

ZEISS endows the "ZEISS Award for Talents in Photomask Industry" 

The award was established in 2016 to support students working in the fields of photomasks.

To be considered,

• The student must present a poster or presentation at European Mask and Lithography Conference
• The students must identify themselves as a student during abstract submission
• The student must be the lead manuscript author
• The student must attend the conference and present it during the session or be present during the poster session

Assessment - Award Committee

The award will be assessed by an award committee consisting of members of the EMLC Program Committee. Contributions will be judged for technical merit, relevance of the topic to the industry and the author’s ability to explain the work.

The Award - Invitation to ZEISS European Summer School

Winners will be awarded a ZEISS certificate and a trophy. He or she will be invited to the ZEISS European Summer School in Oberkochen, Germany, where students get deep insights into ZEISS’ semiconductor optics manufacturing and related aspects of semiconductor technology. The event is triggered by the Important Project of Common European Interest (IPCEI) to support research, innovation and the first industrial deployment of microelectronics and communication technologies across the value chain. 
The winner will have the opportunity to present his/ her paper in this unique environment. Travel costs for the ZEISS European Summer school will be covered.  

Donation

In addition, a donation to the amount of 2,500 EUR will be granted.

Hilton Dresden
An der Frauenkirche 5, 01067 Dresden, 
Germany
phone: +49 (0)351 8642-0
E-Mail: info@hiltondresden.com

Hilton Hotel Dresden - on the doorstep of Dresden's Old Town - Your Event Location

The Hilton Hotel is located at the heart of Dresden's Old Town, one block from the River Elbe and overlooking Dresden's Frauenkirche, the Church of Our Lady. Hilton is within a kilometer of local dining and historic sites, such as the Zwinger building and its surrounding gardens. Enjoy access to the health club, featuring a fitness center, indoor pool with sauna, outdoor whirlpool - and, above all: Enjoy the EMLC Conference 2027 in Dresden!

The room rate is € 152 per night including breakfast.

Reservations can be canceled free of charge up to 7 days before arrival. For cancellations made after this date, 90% of the room rate will be charged as a cancellation fee. A credit card guarantee is required to book a room. 

The room rates quoted include a generous breakfast buffet, service charges, and use of the LivingWell Health Club (fitness center). A fee of €3.00 per person per day is charged for use of the swimming pool, whirlpool, and saunas. The lodging tax applicable in Dresden is not included in the room rate.

Rooms are available from 3:00 p.m. on the day of arrival and may be used until 12:00 p.m. on the day of departure.

Please use the underlined link for your bookings!

Please contact GMM-Office for questions concerning the conference.

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