Toppan Photomasks
2019-06-17 review of event 5 0

EMLC 2019 - 35th European Mask an Lithography Conference, June 17 - 19, Dresden, Germany

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Proceedings

EMLC 2019:
- 3 TUTORIALS + Welcome Speaker + 3 KEYNOTES +
15 INVITED + 14 ORAL + 12 POSTER
- 48 Conference Presentations

The 2 ½ day conference started on Monday, June 17, 2019 at 14:00 with a TUTORIAL ending at 18:30.

1st Tutorial: Andreas Erdmann, Fraunhofer IISB, Erlangen, Germany, “Alternative Lithographic Techniques for Non-IC Applications”

2nd Tutorial: Laurent Pain, CEA-LETI, Grenoble, France,“Lithography Alternative Solutions”

3rd Tutorial: Martin Sczyrba, AMTC, Dresden, Germany,“Photomask Making Processes and Technologies”

At 18:30 we started with the first part of the Poster Session combined with a Get-Together at the Hilton piano bar.

On Tuesday, June 18, the conference started at 9:00 and ends at 19:15, and at Wednesday, June 19, the conference started at 9:00 and ends at 18:00.

The EMLC2019 conference is dedicated to research, technology and related processes. It provides an overview of the current state of mask and lithography technologies and future strategy. Here, mask manufacturers and users have the opportunity to familiarize themselves with the latest developments and results.

As welcome speaker Robert Franke, Director Office of Economics Development - City of Dresden presented the invited talk: “Smart City Dresden – Bringing Future Technologies on the Road”.

On Tuesday morning, June 18, the first Keynote speaker Udo Bischof, Robert Bosch GmbH, Director Engineering Sensor Process Technology (EPT) was invited. He talked about “Future Trends and Drivers for Sensor Technologies“.

The second Keynote speaker was Nayoa Hayashi of Dai Nippon Printing, Saitama, Japan on „“Electron Multi-Beam Writing of Leading-Edge Masks and NIL Master Templates“.

As third keynote speaker Harry J. Levinson, Principal Lithographer of HJL Lithography, LLC, Saratoga, CA, USA reported “The Potential of EUV Lithography“.